Date：2015-06-12 Browse：3032
Because Apple Watch System in package ( SiP ), Successfully reached, thinness, and powerful features, recent supply chain broke, the end of Apple's upcoming iPhone 6S And the next year iPhone 7 Have been identified towards the whole machine adopts SiP Technical direction, packaging and testing manufacturers ASE WINS Apple SiP Big orders. According to Apple's supply chain revealed that Apple is so bullish on SiP technology development, in addition to the A9 application processors will be used after the next generation of integrated fan-out wafer scale packaging (InFO), launched in the second half of iPhone 6S Significantly reduce PCB Board, more than half will be the SiP module instead, as next year's iPhone 7 may be Apple's first fully SiP Technical models.
Due to the Sun and Apple's factories alone, the industry that the company is expected to continue to take the Apple iPhone 6S/7 SiP OEM modules. In this regard, the ASE said the current SiP line has established a base plates, chips, modules, systems, such as a complete ecological system in the coming 2.5D/3D package confidence to stand out in the market. ASE Chairman said, mobile electronics era has arrived, including smartphones, wearable devices, Internet applications, and traditional PCB manufacturing is no longer applicable,SiP will rise to become mainstream. ( Source: newsletter in)
